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Gold Conductor Pastes (Au)

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8886-A

An alloyed gold paste for creating dense gold films between 1-3 microns that can be etched and gold wire bonded. This material is fired on high temperature underglazes at 850°C.

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8884-G

A RoHS compliant, fritless gold paste designed for applications requiring gold wire bonding. This material shows excellent performance on alumina or on 4920 when fired at 850*C.

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8846-GH

A RoHS compliant alloyed gold paste for large diameter gold and aluminum wire bonding. This material is fired on alumina at 850°C.

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8880-G

A RoHS compliant fritless gold paste, for creating dense gold films between 10-15 microns that can be etched and gold wire bonded. This material is fired on alumina at 980°C.

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8881-B

A fritless gold paste for creating dense gold films between 6-8 microns that can be etched and gold wire bonded. This material is fired on alumina at 850°C.

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8881-BA

An alloyed fritless gold paste for creating dense gold films between 6-8 microns that can be etched and aluminum wire bonded. This material is fired on alumina at 850°C.

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8884-A

An alloyed fritless gold paste with designed for applications on alumina and Beryllia that require large diameter (250 micron) aluminum wire bonding. This material fires between 950°C and 980°C.

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8836-F

A gold paste, designed for applications needing thin gold films (6-9 microns), wire bonding and total firing cycles below 15 minutes. This material is fired on alumina at 850°C.

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8837-G

A gold paste for creating dense gold films between 2-6 microns that can be etched and gold wire bonded. This material is fired on alumina at 850°C.

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8838-VF

A high solids gold conductor designed for hermetic via posts in alumina substrates. This material is fired at 850°C.

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8844-G

A RoHS compliant mixed bonded gold paste for gold wire bonding. This material is fired on alumina at 850*C.

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8846-G

A RoHS compliant alloyed gold paste for gold and aluminum wire bonding. This material is fired on alumina at 850°C.

8846-G Datasheet Add 8846-G to RFQ
8836-A

An alloyed mixed bonded gold paste designed for applications needing thin gold films (6-9 microns) and aluminum wire bonding. This material is fired on alumina at 850°C.

8836-A Datasheet Add 8836-A to RFQ
8831-UF

An unfluxed, gold paste designed for use on fired conductor films to increase wire bond strength. This material is fired between 850°C and 980°C and co-fired at 850°C with ceramic tape.

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8835 (520C)

A gold paste designed to be used for applications requiring a low firing temperature including soda-lime glass. This material is fired at 520°C

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8835-1A

An alloyed gold paste designed for wire bonding with aluminum wire. This material is fired on alumina at 850°C.

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8835-1B

An gold paste designed for wire bonding with gold wire. This material is fired on alumina at 850°C.

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8835-1D

A mixed bonded gold paste designed for use on aluminum nitride substrates. A gold paste designed to be used on aluminum nitride substrates. This material is fired at 850°C.

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8835-VF-G

A high solids gold conductor designed for via posts in multi-layer circuits requiring multiple re-fires. This material is fired between 850°C and 1000°C.

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8813-G

A RoHS gold paste designed for use on aluminum nitride substrates. This material is fired at 850°C.

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8081-C

A RoHS compliant metallo-organic gold paste that is designed to produce fired gold films that are less than 1 micron in fired thickness. This material can be fired between 625°C and 850°C on alumina.

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8081-A

A metallo-organic gold paste that is designed to produce fired gold films that are less than 1 micron in fired thickness. This material can be fired between 625°C and 850°C on alumina.

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8884

A fritless gold paste with designed for applications on alumina and Beryllia that require gold wire bonding. This material is fired between 950°C and 980°C.

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8886

A gold paste for creating dense gold films between 1-3 microns that can be etched and gold wire bonded. This material is fired on high temperature underglazes at 850°C.

8886 Datasheet Add 8886 to RFQ
8880

A fritless gold paste, for creating dense gold films between 10-15 microns that can be etched and gold wire bonded. This material is fired on alumina at 980°C.

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8847

A gold paste for creating dense gold films between 1-3 microns that can be etched and gold wire bonded. This material is fired on alumina at 850°C.

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8844

A fritless gold paste for gold wire bonding. This material is fired on alumina at 850°C.

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8836

A mixed bonded gold paste designed for applications needing thin gold films (6-9 microns) and gold wire bonding. This material is fired on alumina at 850°C.

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803

A gold paste designed for use with ESL low temperature co-fired ceramic tapes (LTCC) for use as an inner layer or top layer metallization. This material can be co-fired with ceramic tape at 850°C.

803 Datasheet Add 803 to RFQ