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Polymer Pastes

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15501

A polymer resistor that cures at 320°C with a nominal value of 40 ohms/square. This material can be blended with 19101 silver paste resistor to create resistor values as low as 15 ohm/square.

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244-T

A transparent resin coating, suitable for protecting silver polymers on glass substrates. This material is thermosetting and cures by cross linking at 125°C.

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242-SB

A mineral-filled epoxy coating which is solvent resistant even under high pressure This material is thermosetting and cures by cross linking at 150°C.

242-SB Datasheet Add 242-SB to RFQ
14401

A polyimide dielectric that cures at 320°C. This polyimide based product is designed for applications that require high temperature stability, good adhesion and electrical insulation.

14401 Datasheet Add 14401 to RFQ
240-SB

A mineral filled, thermosetting modified silicone coating that is designed to protect hybrid circuits and printed circuit boards. This material is thermosetting and cures by cross linking at 150°C.

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240-SB-FL

A mineral filled, thermosetting modified silicone coating that has a high viscosity for fine line printing requirements like solder dam printing. This material is thermosetting and cures by cross linking at 150°C.

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1901-SB

Silver filled, flexible resin material that cures at 150°C for touch panels and flexible solar cells. The after curing the polymer material is resistant to attack from organic solvents.

1901-SB Datasheet Add 1901-SB to RFQ
19102-A

Silver filled, polyimide that cures at 320°C designed for being a resistance heating element. This material is solderable making it suitable for conductor terminations.

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1901-S

A silver filled, flexible resin material that cures at 150°C for touch panels and flexible solar cells.

1901-S Datasheet Add 1901-S to RFQ
1109-S

A silver filled, thermosetting, conductive polymer that cures at 150°C that is used as a polymer resistor termination. It can be plated using electroless nickel to enhance solderability.

1109-S Datasheet Add 1109-S to RFQ
1107-S

A silver filled, thermosetting, conductive polymer that cures at 150°C. It can be plated using electroless nickel to enhance solderability.

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19101

Silver filled, polyimide that cures at 320°C designed for being a resistance heating element. This silver paste can be blended with 14401 to adjust the resistor values.

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1120

A silver filled, resin compound that cures at 150°C for printing conductors on ridged and flexible substrates.

1120 Datasheet Add 1120 to RFQ