ElectroScience - Thick-Film Materials & Ceramic Tapes Logo

Conductor Pastes

Product Purpose PDF Datasheet Add to
Quote
2170-A

A tungsten top side conductor based designed to be co-fired with ceramic tape. It is designed to be fired between 1,500°C and 1,650°C in either wet cracked ammonia atmospheres or wet hydrogen atmospheres.

2170-A Datasheet Add 2170-A to RFQ
2170-B

A tungsten via fill conductor based designed to be co-fired with ceramic tape. It is designed to be fired between 1,500°C and 1,650°C in either wet cracked ammonia atmospheres or wet hydrogen atmospheres.

2170-B Datasheet Add 2170-B to RFQ
2170-C

A tungsten buried conductor based designed to be co-fired with ceramic tape. It is designed to be fired between 1,500°C and 1,650°C in either wet cracked ammonia atmospheres or wet hydrogen atmospheres.

2170-C Datasheet Add 2170-C to RFQ
9598-G

A RoHS complaint platinum silver paste designed to be used on alumina. This material fires at 850°C.

9598-G Datasheet Add 9598-G to RFQ
9595-A

A silver platinum paste designed for applications requiring a low firing temperature including glass, porcelain enameled steel (PES), and ceramic substrates. This material can be fired as low as 580°C.

9595-A Datasheet Add 9595-A to RFQ
9598

A platinum silver paste designed for use with aggressive solders. This material fires at 930°C.

9598 Datasheet Add 9598 to RFQ
9501-C

A platinum silver that is solderable and wire bondable. This material is fired on alumina at 850°C.

9501-C Datasheet Add 9501-C to RFQ
9501-CH

A platinum silver that is solderable for resistor terminations. This material is fired on steel at 850°C.

9501-CH Datasheet Add 9501-CH to RFQ
9512-G

A RoHS compliant platinum silver paste designed for applications requiring solderability and high conductivity. This material is fired at 850°C on alumina.

9512-G Datasheet Add 9512-G to RFQ
9562-G

A RoHS compliant platinum palladium silver paste designed for use on aluminum nitride where large diameter aluminum wire bonding is required. This material is fired at 930°C.

9562-G Datasheet Add 9562-G to RFQ
953

A platinum silver paste designed as a solderable top layer metallization with low temperature co-fired ceramic (LTCC) tapes fired at a peak firing temperature of 850°C.

953 Datasheet Add 953 to RFQ
9512

A mixed-bonded platinum silver designed for applications requiring solderability and high conductivity.. This material is fired at 850°C on alumina.

9512 Datasheet Add 9512 to RFQ
9516

A platinum silver paste designed to be the electrodes for ESL 4150 Series and 4200-C Series capacitors. This material is fired on alumina at 900°C.

9516 Datasheet Add 9516 to RFQ
9566

A mixed-bonded platinum palladium silver paste designed to be used in mixed metal systems. This material is fired at 850°C.

9566 Datasheet Add 9566 to RFQ
9565

A mixed-bonded platinum palladium silver paste designed for use as a resistor termination. This material can be fired at 850°C.

9565 Datasheet Add 9565 to RFQ
9564

A platinum palladium silver paste designed for applications with aggressive solders. This material is fired at 850°C.

9564 Datasheet Add 9564 to RFQ
9562

A platinum palladium silver paste designed for use on aluminum nitride where large diameter aluminum wire bonding is required. This material is fired at 930°C.

9562 Datasheet Add 9562 to RFQ
9694-SA

A silver palladium paste designed as the resistor termination for potentiometer applications where high throughput production is required. This material is fired at 850°C on alumina.

9694-SA Datasheet Add 9694-SA to RFQ
C-964-G

A RoHS compliant silver palladium paste with excellent solderability. This material is fired on alumina at 850°C.

C-964-G Datasheet Add C-964-G to RFQ
9695-G

A silver palladium paste designed to be used on alumina and porcelain enameled steel to be used for ground plane and buried conductor layers in multi-layer hybrid circuits. This material is fired between 625°C and 930°C.

9695-G Datasheet Add 9695-G to RFQ
9695-P

A silver palladium conductor designed for use in potentiometer applications. This material can be fired as low at 625°C on alumina.

9695-P Datasheet Add 9695-P to RFQ
C-964-A

A silver palladium paste designed for termination on the ESL R-300 series resistors. This material is fired on alumina at 850°C.

C-964-A Datasheet Add C-964-A to RFQ
9693-S-A

A silver palladium paste that is designed for applications requiring high speed printing. This material is fired at 850°C on alumina.

9693-S-A Datasheet Add 9693-S-A to RFQ
9693-G

A RoHS compliant silver palladium paste that is fired at 850C on alumina.

9693-G Datasheet Add 9693-G to RFQ
9635-HG

A RoHS compliant silver palladium paste with a 6:1 ratio. This material is fired at 850°C on alumina.

9635-HG Datasheet Add 9635-HG to RFQ
9635-H

A silver palladium paste with a 6:1 ratio. This material is fired at 850°C on alumina.

9635-H Datasheet Add 9635-H to RFQ
9635-B

A silver palladium paste with a 3:1 ratio. This material is fired at 850°C on alumina.

9635-B Datasheet Add 9635-B to RFQ
9633-G

A silver palladium paste with a 2:1 ratio for applications that require aggressive soldering conditions. This material is fired at 850°C on alumina.

9633-G Datasheet Add 9633-G to RFQ
9695

A silver palladium paste with a 20:1 ratio designed for applications requiring a low firing temperature including porcelain enameled steel (PES). This material is fired as low as 625°C.

9695 Datasheet Add 9695 to RFQ
9647

A RoHS compliant silver palladium paste with a 3:1 ratio designed for applications needing large diameter aluminum wire bonding. This material is fired at 850°C on alumina.

9647 Datasheet Add 9647 to RFQ
9633-T

A silver palladium paste designed for use on aluminum nitride. This material is fired at 850°C.

9633-T Datasheet Add 9633-T to RFQ
9638

A silver palladium paste with a 3:1 ratio designed for use as an electrode for ESL4113-H and 4117 capacitors. This material is fired on alumina at 980°C.

9638 Datasheet Add 9638 to RFQ
9627

A RoHS compliant silver palladium paste designed to for use as a current collector for solid oxide fuel cells. This material is post fired on zirconia at 850°C.

9627 Datasheet Add 9627 to RFQ
963

A silver palladium paste designed as a solderable top layer metallization with low temperature co-fire ceramic (LTCC) tapes fired at a peak firing temperature of 850°C.

963 Datasheet Add 963 to RFQ
9996-B

A silver paste designed for porcelain enameled steal (PES). This material is fired at 625°C on PES.

9996-B Datasheet Add 9996-B to RFQ
9912-THP

A mixed bonded silver paste designed for through hole via printing on 96% alumina. This material is fired at 850°C.

9912-THP Datasheet Add 9912-THP to RFQ
9912-MM

A RoHS compliant silver paste designed with a low firing temperature for Piezo applications. This material is fired at 625°C.

9912-MM Datasheet Add 9912-MM to RFQ
9912-A

A mixed bonded silver paste designed to be used on porcelain enameled steel, alumina and Beryllia for use in chip resistors, potentiometers, hybrid circuits, and heater elements. This material is fired between 625°C and 930°C.

9912-A Datasheet Add 9912-A to RFQ
9912-F

A silver paste designed for use as a resistor termination with use with ESL resistors. This material is fired on alumina at 850°C.

9912-F Datasheet Add 9912-F to RFQ
9912-G

A RoHS compliant silver paste designed to be fired at 850°C on alumina.

9912-G Datasheet Add 9912-G to RFQ
9912-K

A RoHS compliant silver paste designed with a wide processing temperature for use on porcelain enameled steel, alumina and Beryllia. This material is fired between 625°C and 930°C depending on the substrate.

9912-K Datasheet Add 9912-K to RFQ
9912-K FL

A RoHS compliant silver paste designed with fine line printing capability for use on porcelain enameled steel, alumina and Beryllia. This material is fired between 625°C and 930°C depending on the substrate.

9912-K FL Datasheet Add 9912-K FL to RFQ
9912-K Thick Print

A RoHS compliant mix bonded silver paste designed for creating thick silver prints. This material is fired between 850°C and 930°C on alumina.

9912-K Thick Print Datasheet Add 9912-K Thick Print to RFQ
9910-C

A silver palladium paste designed for use on PZT and glass. This material is fired between 580°C and 700°C.

9910-C Datasheet Add 9910-C to RFQ
903-D

A silver paste designed to be used as a solderable top-layer metallization to be post fired on low temperature co-fired ceramic (LTCC) tape at 850°C.

903-D Datasheet Add 903-D to RFQ
903-C

A silver paste designed for use as a solderable top-layer conductor with low temperature co-fire ceramic (LTCC) tapes fired at a peak firing temperature of 850°C.

903-C Datasheet Add 903-C to RFQ
903-B

A silver paste designed for use as ground plane conductor with low temperature co-fire ceramic (LTCC) tapes at a peak firing temperature of 850°C.

903-B Datasheet Add 903-B to RFQ
903-A

A silver paste designed for use as inner layer conductor with low temperature co-fire ceramic (LTCC) tapes fired at 850°C.

903-A Datasheet Add 903-A to RFQ
599-E

A silver paste designed for applications requiring a low firing temperature including glass, porcelain enameled steel (PES), and ceramic substrates. This material can be fired as low as 400°C.

599-E Datasheet Add 599-E to RFQ
599-G

A silver paste designed for applications requiring a low firing temperature including glass, porcelain enameled steel (PES), and ceramic substrates. This material is fired between 450°C and 580°C.

599-G Datasheet Add 599-G to RFQ
590-G

A silver paste designed for applications requiring a low firing temperature including glass, porcelain enameled steel (PES), and ceramic substrates. This material is fired between 450°C and 580°C.

590-G Datasheet Add 590-G to RFQ
9990

A fritless silver paste designed for good adhesion to 96% alumina, 99.5% alumina, beryllia and ferrite. This material is fired at 900°C.

9990 Datasheet Add 9990 to RFQ
9916

A silver paste designed for use as a capacitor electrode with ESL D-4150 Series and D-4200-C Series of dielectrics. This material is fired at 900°C on alumina.

9916 Datasheet Add 9916 to RFQ
9903

A RoHS compliant silver paste designed for use on aluminum. This material is fired at 530°C.

9903 Datasheet Add 9903 to RFQ
9907

A RoHS compliant silver paste designed for use as a current collector for solid oxide fuel cells. This material is fired at 850°C.

9907 Datasheet Add 9907 to RFQ
9912

A mixed bonded silver paste designed with a wide processing temperature use on porcelain enameled steel, alumina and Beryllia. This material is fired between 625°C and 930°C depending on the substrate.

9912 Datasheet Add 9912 to RFQ
9913

A silver paste designed for use on aluminum nitride substrates. This material is fired at 850°C.

9913 Datasheet Add 9913 to RFQ
902

A silver paste designed for use as a via fill with low temperature co-fired ceramic (LTCC) tapes at a peak firing temperature of 850°C.

902 Datasheet Add 902 to RFQ
1901-SB

Silver filled, flexible resin material that cures at 150°C for touch panels and flexible solar cells. The after curing the polymer material is resistant to attack from organic solvents.

1901-SB Datasheet Add 1901-SB to RFQ
19102-A

Silver filled, polyimide that cures at 320°C designed for being a resistance heating element. This material is solderable making it suitable for conductor terminations.

19102-A Datasheet Add 19102-A to RFQ
590

A silver paste designed for applications requiring a low firing temperature including glass, porcelain enameled steel (PES), and ceramic substrates. This material is fired between 500°C and 700°C.

590 Datasheet Add 590 to RFQ
1901-S

A silver filled, flexible resin material that cures at 150°C for touch panels and flexible solar cells.

1901-S Datasheet Add 1901-S to RFQ
1109-S

A silver filled, thermosetting, conductive polymer that cures at 150°C that is used as a polymer resistor termination. It can be plated using electroless nickel to enhance solderability.

1109-S Datasheet Add 1109-S to RFQ
1107-S

A silver filled, thermosetting, conductive polymer that cures at 150°C. It can be plated using electroless nickel to enhance solderability.

1107-S Datasheet Add 1107-S to RFQ
19101

Silver filled, polyimide that cures at 320°C designed for being a resistance heating element. This silver paste can be blended with 14401 to adjust the resistor values.

19101 Datasheet Add 19101 to RFQ
1120

A silver filled, resin compound that cures at 150°C for printing conductors on ridged and flexible substrates.

1120 Datasheet Add 1120 to RFQ
5837

A platinum gold paste designed for resistor terminations in hybrid circuits. This material has excellent bond strength and is fired with alumina at 850°C.

5837 Datasheet Add 5837 to RFQ
5837-G

A platinum gold paste designed for multiple firings. This material is fired on alumina at 850°C. When printed on 4917, this material can also be used on Beryllia.

5837-G Datasheet Add 5837-G to RFQ
5837-A

A platinum gold paste with excellent solder leach resistance. This material is fired on 4905-C at 850°C.

5837-A Datasheet Add 5837-A to RFQ
5800-B

A platinum gold paste designed for applications with multiple re-fires (>30). This material has excellent solder leach resistance and is fired with alumina between 850°C and 980°C.

5800-B Datasheet Add 5800-B to RFQ
5867

A platinum, palladium, gold paste designed for resistor terminations with excellent bond strength to dielectrics. This material is fired on alumina between 850°C and 930°C.

5867 Datasheet Add 5867 to RFQ
5559-B

A platinum paste designed to be co-fired with high temperature ceramic tape to create a high resistance heater. This material is co-fired with alumina or zirconia between 1450°C to 1550°C.

5559-B Datasheet Add 5559-B to RFQ
5545-LS

A fritted platinum conductor designed for use as a heating element. This material is the thin printing version of 5545 and can be fired between 850°C and 1300°C alumina or zirconia to a thickness of 4 microns.

5545-LS Datasheet Add 5545-LS to RFQ
5575

A platinum paste designed to be co-fired with high temperature ceramic tape to create a via conductors for planar oxygen sensors. This material is co-fired with alumina or zirconia between 1450°C and 1550°C.

5575 Datasheet Add 5575 to RFQ
5541-A

A RoHS compliant platinum conductor. This material is fired at 1350°C on alumina.

5541-A Datasheet Add 5541-A to RFQ
5574

A platinum paste designed to be co-fired with high temperature ceramic tape to create a conductor leads for planar oxygen sensors. This material is co-fired with alumina or zirconia between 1450°C and 1550°C.

5574 Datasheet Add 5574 to RFQ
5573

A platinum paste designed to be the outer electrode in conical oxygen sensors. This material is fired between 1250°C and 1500°C on partially stabilized zirconia substrates.

5573 Datasheet Add 5573 to RFQ
5572

A platinum paste designed to be the inner electrode in conical oxygen sensors. This material is fired between 1250°C and 1500°C on partially stabilized zirconia substrates.

5572 Datasheet Add 5572 to RFQ
5571

A platinum paste designed to be co-fired with high temperature ceramic tape to create a resistance heater in planar oxygen sensors. This material is co-fired with alumina or zirconia between 1450°C and 1550°C.

5571 Datasheet Add 5571 to RFQ
5570

A porous platinum paste designed to be co-fired with zirconia ceramic tape to create the inner and outer electrode in planar oxygen sensors. This material is co-fired with zirconia between 1450°C and 1550°C.

5570 Datasheet Add 5570 to RFQ
5545

A fritted platinum conductor designed for use as a resistance heating element. This material can be fired between 850°C and 1300°C on alumina or zirconia.

5545 Datasheet Add 5545 to RFQ
5544

A fritted platinum conductor for use in resistance temperature detectors (RTDs) and resistance heater applications. This material can be fired between 980°C and 1300°C on alumina.

5544 Datasheet Add 5544 to RFQ
6642

A RoHS compliant palladium paste designed for use on partially stabilized zirconia (PSZ) for use in oxygen sensors. This material is fired between 1250°C and 1450°C.

6642 Datasheet Add 6642 to RFQ
5051

A thin printing metallo-organic platinum designed for resistance temperature detectors (RTDs) and other applications. This material fires at 850°C on alumina or glazed ceramic to a fired thickness of 1 micron or less.

5051 Datasheet Add 5051 to RFQ
5542

A fritless platinum paste designed to be the inner and outer electrodes in conical oxygen sensors. This material is fired between 950°C and 1300°C on partially stabilized zirconia substrates.

5542 Datasheet Add 5542 to RFQ
2554-N-1

An air fired nickel conductor used as a cathode in displays. The nickel pastes have a firing range of 580°C to 625°C.

2554-N-1 Datasheet Add 2554-N-1 to RFQ
8886-A

An alloyed gold paste for creating dense gold films between 1-3 microns that can be etched and gold wire bonded. This material is fired on high temperature underglazes at 850°C.

8886-A Datasheet Add 8886-A to RFQ
8884-G

A RoHS compliant, fritless gold paste designed for applications requiring gold wire bonding. This material shows excellent performance on alumina or on 4920 when fired at 850*C.

8884-G Datasheet Add 8884-G to RFQ
8846-GH

A RoHS compliant alloyed gold paste for large diameter gold and aluminum wire bonding. This material is fired on alumina at 850°C.

8846-GH Datasheet Add 8846-GH to RFQ
8880-G

A RoHS compliant fritless gold paste, for creating dense gold films between 10-15 microns that can be etched and gold wire bonded. This material is fired on alumina at 980°C.

8880-G Datasheet Add 8880-G to RFQ
8881-B

A fritless gold paste for creating dense gold films between 6-8 microns that can be etched and gold wire bonded. This material is fired on alumina at 850°C.

8881-B Datasheet Add 8881-B to RFQ
8881-BA

An alloyed fritless gold paste for creating dense gold films between 6-8 microns that can be etched and aluminum wire bonded. This material is fired on alumina at 850°C.

8881-BA Datasheet Add 8881-BA to RFQ
8884-A

An alloyed fritless gold paste with designed for applications on alumina and Beryllia that require large diameter (250 micron) aluminum wire bonding. This material fires between 950°C and 980°C.

8884-A Datasheet Add 8884-A to RFQ
8836-F

A gold paste, designed for applications needing thin gold films (6-9 microns), wire bonding and total firing cycles below 15 minutes. This material is fired on alumina at 850°C.

8836-F Datasheet Add 8836-F to RFQ
8837-G

A gold paste for creating dense gold films between 2-6 microns that can be etched and gold wire bonded. This material is fired on alumina at 850°C.

8837-G Datasheet Add 8837-G to RFQ
8838-VF

A high solids gold conductor designed for hermetic via posts in alumina substrates. This material is fired at 850°C.

8838-VF Datasheet Add 8838-VF to RFQ
8844-G

A RoHS compliant mixed bonded gold paste for gold wire bonding. This material is fired on alumina at 850*C.

8844-G Datasheet Add 8844-G to RFQ
8846-G

A RoHS compliant alloyed gold paste for gold and aluminum wire bonding. This material is fired on alumina at 850°C.

8846-G Datasheet Add 8846-G to RFQ
8836-A

An alloyed mixed bonded gold paste designed for applications needing thin gold films (6-9 microns) and aluminum wire bonding. This material is fired on alumina at 850°C.

8836-A Datasheet Add 8836-A to RFQ
8831-UF

An unfluxed, gold paste designed for use on fired conductor films to increase wire bond strength. This material is fired between 850°C and 980°C and co-fired at 850°C with ceramic tape.

8831-UF Datasheet Add 8831-UF to RFQ
8835 (520C)

A gold paste designed to be used for applications requiring a low firing temperature including soda-lime glass. This material is fired at 520°C

8835 (520C) Datasheet Add 8835 (520C) to RFQ
8835-1A

An alloyed gold paste designed for wire bonding with aluminum wire. This material is fired on alumina at 850°C.

8835-1A Datasheet Add 8835-1A to RFQ
8835-1B

An gold paste designed for wire bonding with gold wire. This material is fired on alumina at 850°C.

8835-1B Datasheet Add 8835-1B to RFQ
8835-1D

A mixed bonded gold paste designed for use on aluminum nitride substrates. A gold paste designed to be used on aluminum nitride substrates. This material is fired at 850°C.

8835-1D Datasheet Add 8835-1D to RFQ
8835-VF-G

A high solids gold conductor designed for via posts in multi-layer circuits requiring multiple re-fires. This material is fired between 850°C and 1000°C.

8835-VF-G Datasheet Add 8835-VF-G to RFQ
8813-G

A RoHS gold paste designed for use on aluminum nitride substrates. This material is fired at 850°C.

8813-G Datasheet Add 8813-G to RFQ
8081-C

A RoHS compliant metallo-organic gold paste that is designed to produce fired gold films that are less than 1 micron in fired thickness. This material can be fired between 625°C and 850°C on alumina.

8081-C Datasheet Add 8081-C to RFQ
8081-A

A metallo-organic gold paste that is designed to produce fired gold films that are less than 1 micron in fired thickness. This material can be fired between 625°C and 850°C on alumina.

8081-A Datasheet Add 8081-A to RFQ
8884

A fritless gold paste with designed for applications on alumina and Beryllia that require gold wire bonding. This material is fired between 950°C and 980°C.

8884 Datasheet Add 8884 to RFQ
8886

A gold paste for creating dense gold films between 1-3 microns that can be etched and gold wire bonded. This material is fired on high temperature underglazes at 850°C.

8886 Datasheet Add 8886 to RFQ
8880

A fritless gold paste, for creating dense gold films between 10-15 microns that can be etched and gold wire bonded. This material is fired on alumina at 980°C.

8880 Datasheet Add 8880 to RFQ
8847

A gold paste for creating dense gold films between 1-3 microns that can be etched and gold wire bonded. This material is fired on alumina at 850°C.

8847 Datasheet Add 8847 to RFQ
8844

A fritless gold paste for gold wire bonding. This material is fired on alumina at 850°C.

8844 Datasheet Add 8844 to RFQ
8836

A mixed bonded gold paste designed for applications needing thin gold films (6-9 microns) and gold wire bonding. This material is fired on alumina at 850°C.

8836 Datasheet Add 8836 to RFQ
803

A gold paste designed for use with ESL low temperature co-fired ceramic tapes (LTCC) for use as an inner layer or top layer metallization. This material can be co-fired with ceramic tape at 850°C.

803 Datasheet Add 803 to RFQ
4421-A

A cathode paste that contains lanthanum strontium cobalt ferrite (LSCF). This material is designed for use in SOFC applications.

4421-A Datasheet Add 4421-A to RFQ
4481

An electrolyte paste containing 8 mol% Yttria stabilized zirconia. This material is fired on a nickel oxide anode for use in SOFC applications.

4481 Datasheet Add 4481 to RFQ
4482

A ceramic interconnect paste that contains lanthanum strontium cobalt chromite and is designed for use in SOFC applications.

4482 Datasheet Add 4482 to RFQ
4480

A ceramic interconnect paste that contains lanthanum calcium chromite and is designed for use in SOFC applications.

4480 Datasheet Add 4480 to RFQ
4422

A cathode paste that contains a 50/50 ratio of Lanthanum Strontium Manganite (LSM) and 8mol % yttria stabilized zirconia (YSZ). This material is designed for use in SOFC applications.

4422 Datasheet Add 4422 to RFQ
4420

A cathode paste containing lanthanum strontium manganese oxide (LSM). This material is designed for use in SOFC applications.

4420 Datasheet Add 4420 to RFQ
4416

A functional anode paste that contains a 65/35 ratio of nickel oxide and 8mol % yttria stabilized zirconia (YSZ). This material is designed for use in SOFC applications.

4416 Datasheet Add 4416 to RFQ
4412

A functional anode paste that contains a 50/50 ratio of nickel oxide and 8mol % yttria stabilized zirconia (YSZ). This material is designed for use in SOFC applications.

4412 Datasheet Add 4412 to RFQ
4343

An electrolyte paste containing 20 mol % gadolinia doped ceria (GDC). This material is fired on a nickel oxide anode between 1200°C and 1300°C for use in SOFC applications.

4343 Datasheet Add 4343 to RFQ
4410

A nickel oxide anode paste. This material is fired on zirconia for use in SOFC applications

4410 Datasheet Add 4410 to RFQ
4411

A nickel oxide anode paste containing a pore-former to enhance post-fired porosity. This material is fired on zirconia for use in SOFC applications

4411 Datasheet Add 4411 to RFQ
2312-A-3

A copper paste designed to print thick (70 microns) to conduct higher currents. This material is fired between 900°C and 980°C in nitrogen.

2312-A-3 Datasheet Add 2312-A-3 to RFQ
2312-G

A RoHS compliant copper conductor paste. This material is fired on Alumina or Aluminum Nitride between 900°C and 980°C.

2312-G Datasheet Add 2312-G to RFQ
2323-HV

A 72% Ag / 28% Cu eutectic brazing alloy with a high viscosity for improved print quality or syringe applications. This paste is designed for joining metal parts to moly-manganese or nickel-metallized ceramic in high temperature applications. This material is fired at a peak temperature of 810°C in wet hydrogen or forming gas.

2323-HV Datasheet Add 2323-HV to RFQ
2323

A 72% Ag / 28% Cu eutectic brazing alloy for joining metal parts to moly-manganese or nickel-metallized ceramic in high temperature applications. This material is fired at a peak temperature of 810°C in wet hydrogen or forming gas.

2323 Datasheet Add 2323 to RFQ