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9566

9566 Datasheet Add 9566 to RFQ

A mixed-bonded platinum palladium silver paste designed to be used in mixed metal systems. This material is fired at 850°C.

Additional Information
Product Features: solderable, Thermosonic gold wire bonding, Ultrasonic aluminum wire bonding, mixed metal systems
Compatible Substrate:

Alumina, Aluminum Oxide (Al2O3)

Common Uses: Chip resistors, resistance heating, C1 layer
Technical Name: Alloyed, mixed bonded conductor
Firing Type: Post-Fired Ceramic