ElectroScience - Thick-Film Materials & Ceramic Tapes Logo


8835-1D Datasheet Add 8835-1D to RFQ

A mixed bonded gold paste designed for use on aluminum nitride substrates. A gold paste designed to be used on aluminum nitride substrates. This material is fired at 850°C.

Additional Information
Product Features: Thermosonic gold wire bonding
Compatible Substrate:

Aluminum Nitride (AlN)

Common Uses: automotive, components, medical, LED
Technical Name: mixed bonded conductor
Firing Type: Post-Fired Ceramic
Click to list related products: