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8886 Datasheet Add 8886 to RFQ

A gold paste for creating dense gold films between 1-3 microns that can be etched and gold wire bonded. This material is fired on high temperature underglazes at 850°C.

Additional Information
Product Features: Thermosonic gold wire bonding, acid etchable, thin printing
Compatible Substrate:

Alumina, Aluminum Oxide (Al2O3)

Common Uses: Components, RF, Microwave, chip fuses
Technical Name: metalorganics, metallo-organics
Firing Type: Post-Fired Ceramic
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