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8836 Datasheet Add 8836 to RFQ

A mixed bonded gold paste designed for applications needing thin gold films (6-9 microns) and gold wire bonding. This material is fired on alumina at 850°C.

Additional Information
Product Features: Thermosonic gold wire bonding, thin printing
Compatible Substrate:

Alumina, Aluminum Oxide (Al2O3)

Common Uses: automotive, components, medical
Technical Name: mixed bonded conductor
Firing Type: Post-Fired Ceramic
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