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9912-THP Datasheet Add 9912-THP to RFQ

A mixed bonded silver paste designed for through hole via printing on 96% alumina. This material is fired at 850°C.

Additional Information
Product Features: Solderable, Through-hole printing, via printing, via coating
Compatible Substrate:

Alumina, Aluminum Oxide (Al2O3)

Environmental Compliance: RoHS with exemption
Common Uses: components
Technical Name: mixed bonded conductor
Firing Type: Post-Fired Ceramic