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8881-BA

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An alloyed fritless gold paste for creating dense gold films between 6-8 microns that can be etched and aluminum wire bonded. This material is fired on alumina at 850°C.

Additional Information
Product Features: Thermosonic gold wire bonding, Ultrasonic aluminum wire bonding, acid etchable
Compatible Substrate:

Alumina, Aluminum Oxide (Al2O3)

Common Uses: Components
Technical Name: Alloyed, fritless conductor
Firing Type: Post-Fired Ceramic