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8837-G

8837-G Datasheet Add 8837-G to RFQ

A gold paste for creating dense gold films between 2-6 microns that can be etched and gold wire bonded. This material is fired on alumina at 850°C.

Additional Information
Product Features: Thermosonic gold wire bonding, thin printing
Compatible Substrate:

Alumina, Aluminum Oxide (Al2O3)

Environmental Compliance: Cadmium-free (Cd-free)|Lead-free (Pb-free)|Nickel-free (Ni-Free)|RoHS Compliant
Common Uses: automotive, pressure sensors
Technical Name: etchable, oxide bonded conductor
Firing Type: Post-Fired Ceramic